Beschreibung
Mit der neuen Nuvo-7000er Serie mit eingebauten Intel®-CPU der 8. Generation bringt Neousys ein neues Performance-Level in die Welt der Embedded Computer.
Das Low-Profile Gehäuse des 7002LP mit nur 79 mm Höhe ermöglicht den Einbau auch in enge Nischen. Ergänzt durch COM–Ports, MezIO™ Schnittstelle sowie HotSwap für den schnellen, unkomplizierten Austausch von SSD´s lässt sich die 7000er Serie in jeden Arbeitsablauf integrieren. Das lüfterlose, robusten Design macht ihn zu einem zuverlässigen Industrie PC.
Technische Daten
System Core |
Processor |
Intel® 8th-Gen Coffee Lake 6-core CPU (LGA1151 socket, 35W/ 65W TDP)
|
Chipset |
Intel® Q370 Platform Controller Hub |
Graphics |
Integrated Intel® UHD Graphics 630 |
Memory |
Up to 32 GB DDR4 2666/2400 SDRAM (two SODIMM slots) |
AMT |
Supports AMT 12.0 |
TPM |
Supports TPM 2.0 |
I/O Interface |
Ethernet |
2x Gigabit Ethernet ports by I219 and I210 (Nuvo-7002LP) 6x Gigabit Ethernet ports by I219 and 5x I210 (Nuvo-7006LP) |
POE+ |
Optional IEEE 802.3at PoE+ PSE for Port 3 ~ Port 6 100 W total power budget |
USB |
4x USB 3.1 Gen2 (10 Gbps) ports 4x USB 3.1 Gen1 (5 Gbps) ports |
Video Port |
1x VGA connector, supporting 1920 x 1200 resolution 1x DVI-D connector, supporting 1920 x 1200 resolution 1x DisplayPort connector, supporting 4096 x 2304 resolution |
Serial Port |
2x software-programmable RS-232/422/485 ports (COM1/ COM2) 2x RS-232 ports (COM3/ COM4) |
Audio |
1x 3.5 mm jack for mic-in and speaker-out |
Internal Expansion Bus |
Mini PCI-E |
1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA)
|
M.2 |
1x M.2 2242 B key socket with dual front-accessible SIM sockets |
Expandable I/O |
1x MezIO™ expansion port for Neousys MezIO™ modules |
Storfage interface |
SATA HDD |
1x front-accessible, hot-swappable 2.5” HDD/SSD tray 1x internal SATA port for 2.5” HDD/SSD installation, supporting RAID 0/ 1 |
mSATA |
1x full-size mSATA port (mux with mini-PCIe) |
M.2 NVMe |
1x M.2 2280 M key NVMe socket (PCIe Gen3/ x4) for NVMe SSD installation |
Power Supply |
DC Input |
1x 3-pin pluggable terminal block for 8~35VDC DC input |
Remote Ctrl. & Status Output |
1x 3-pin pluggable terminal block for remote control and PWR LED output |
Mechanical |
Dimension |
240 mm (W) x 225 mm (D) x 79 mm (H) |
Weight |
– |
Mounting |
Wall-mounting /standard) or DIN-Rail mounting (optional)
|
Environmental |
Operating Temperature |
with 35W CPU -25°C ~ 70°C
with 65W CPU -25°C ~ 70°C */** (configured as 35W TDP) -25°C ~ 50°C */** (configured as 65W TDP)
|
Storage Temperature |
-40°C ~ 85°C |
Humidity |
10% ~ 90%, non-condensing |
Vibration |
Operating, MIL-STD-810G, Method 514.6, Category 4 |
Shock |
Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
EMC |
CE/FCC Class A, according to EN 55022 & EN 55024 |
* For i7-8700 running at 65W mode, the highest operating temperature shall be limited to 50°C and thermal throttling may occur when sustained full-loading applied. Users can configure CPU power in BIOS to obtain higher operatiing temperature.
** For fub-zero operating temperature, a wide temperature HDD or Solid State Disk (SSD) is required.